ELECTRICAL DESIGN CAPABILITIES

• Electrical System Design

• Electronic Components Selection

• Schematic Design and Layout

• BOM Creation and Release

• Circuit Board Building Support

• System Integration

• Bring up/Debug,Function Testing and SPIT

• Analog/Digital/High Speed Digital

• MCU, DSP, ARM and low power X86

• FPGA/CPLD

• SDRAM, DDR1/2/3

• Power Managemen(DC/DC, Battery Management )

• Wireless CommunicationWi-Fi, BT/BLE, Zigbee, Cellular, ISM, MICS)

• Miniaturization design

PCB DESIGN CAPABILITIES

• Single sided,low complexity,low cost design

• Highly complex multi layer HDI design

• RF & High speed design

• Flexible PCB& Rigid-Flex

• Miniaturization Design

• DFF（Design for PCB fabrication）

• DFM（Design for manufacturing）

• DFT（Design for testeability）

• DFE（Design for environment)

• DFS（Design for Serviceability）

Mechanical DESIGN CAPABILITIES

• Plastic

• Sheet Metal

• High Precision Mechatronics

• Casting

• 3D Modeling/2D

• Thermal Analysis

• Structural Analysis

• Quick Prototyping

• Model  Flow analysis

• Tooling Cost/Risk Analysis

• Vendor Evaluation and Selection

• Tooling qualification

• Part qualification

SOFTWARE DESIGN CAPABILITIES

• Requirements Analysis

• Concept Design

• System Architecture Design

• Detail Design and Development

  1.BSP and Driver Development

  2.Embedded Application Development

  3.User Interface Design

  4.Protocol Implementation

• Software Verification Test

• Diagnostics Software Design

• Compliance with ISO62304

• Embedded Control Firmware

• Hardware Testing Code

• RTOS Integration (Embedded Linux, Embedded Windows)

• Drivers & Applications

• High Level Languages(C, C++, Visual C++, VB)

• Apps SW development( IOS & Android)